IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
€46.00
IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
€93.00
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
€74.00
€118.00
Printed circuits; fundamental parameters, guidance for the design and use of components
€41.78
Metal-clad base materials for printed circuits; test methods
€56.17
Metal-clad base material for printed circuits; specifications
Printed circuits; printed boards, general requirements and tests
€69.91
Printed circuits; printed boards, drawings
€24.39
Terms and definitions for printed circuits
€77.20
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-36 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées en tissu de verre de type E époxyde, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
€111.67
PRINTED WIRING TECHNIQUES: GRID SYSTEM
€15.00
BASE MATERIALS FOR PRINTED CIRCUITS. TEST METHODS.
€90.00
METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. GENERAL SPECIFICATIONS
€40.00
€18.00
