Electronic components. Printed wiring. Rework of printed boards.
€65.33
Basic material for printed wiring; laminated copper clad sheets, dimensions, weigths
€60.75
Basic material for printed wiring; laminated copper clad sheets, technical specification
€137.66
Connectors for printed boards (flat contacts, single row); edge socket connectors-edge board contacts
€24.39
Fixed folding durability test method for flexible opto-electric circuit boards
€63.00
Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
€70.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
€86.00
Materials for printed boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials, clad and unclad - Ptfe filled laminate sheets of defined flammability (vertical burning test), copper-clad
€87.00
Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
€84.58
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
€69.91
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (IEC 91/1749/CD:2021); Text in German and English
€91.03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
€63.27
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
€98.32
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
