31.180 : Printed circuits and boards

UNE 20620-4:1980

UNE 20620-4:1980

Withdrawn Most Recent

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL

€50.00

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UNE 20621-2:1980

UNE 20621-2:1980

Withdrawn Most Recent

PRINTED BOARDS. TEST METHODS

€76.00

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UNE 20621-2/1C:1982

UNE 20621-2/1C:1982

Withdrawn Most Recent

PRINTED BOARDS. TEST METHODS

€40.00

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UNE 20621-2/2C:1985

UNE 20621-2/2C:1985

Withdrawn Most Recent

PRINTED BOARDS. TEST METHODS

€54.00

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UNE 20621-3:1984

UNE 20621-3:1984

Withdrawn Most Recent

PRINTED BOARDS. PART 3: DESIGN AND USE OF PRINTED BOARDS

€69.00

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UNE 20621-3/1C:1985

UNE 20621-3/1C:1985

Withdrawn Most Recent

PRINTED BOARDS. DESIGN AND USE OF PRINTED BOARDS

€40.00

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UNE 20621-4:1983

UNE 20621-4:1983

Withdrawn Most Recent

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLAIN HOLES

€54.00

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UNE 20621-5:1985

UNE 20621-5:1985

Withdrawn Most Recent

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLATED-THROUGH HOLES

€64.00

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UNE 20621-6:1985

UNE 20621-6:1985

Withdrawn Most Recent

PRINTED BOARDS. SPECIFICATION FOR MULTILAYER PRINTED BOARDS

€69.00

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UNE 20621-7:1985

UNE 20621-7:1985

Withdrawn Most Recent

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS

€69.00

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UNE 20621-8:1985

UNE 20621-8:1985

Withdrawn Most Recent

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS

€69.00

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UNE 20902:1993

UNE 20902:1993

Superseded Historical

TERMS AND DEFINITIONS FOR PRINTED CIRCUITS.

€72.00

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IEC 61188-6-4:2019

IEC 61188-6-4:2019

Active Most Recent

IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

€342.00

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IEC 61189-2-630:2018

IEC 61189-2-630:2018

Active Most Recent

IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

€23.00

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IEC 62878-2-602:2021

IEC 62878-2-602:2021

Active Most Recent

IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

€93.00

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