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IEC 62326-4:1996
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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Summary
Applicable to rigid multilayer printed boards irrespective of their
method of manufacture. It is the basis on which agreements between
manufacturer and user are to be made.
Provides additional information necessary to supplement the
requirements of the Generic Specification, IEC 62326-1, for the
printed boards intended to be accepted under the IECQ system.
Establishes uniform requirements, specifies the characteristics to
be assessed and the test methods to be used for quality
conformance.
method of manufacture. It is the basis on which agreements between
manufacturer and user are to be made.
Provides additional information necessary to supplement the
requirements of the Generic Specification, IEC 62326-1, for the
printed boards intended to be accepted under the IECQ system.
Establishes uniform requirements, specifies the characteristics to
be assessed and the test methods to be used for quality
conformance.
Notes
Valable en conjointement avec IEC 62326-1 (2002-03), IEC 62326-4-1 (1996-12).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 12/19/1996 |
| Release Date | 12/19/1996 |
| Edition | 1 |
| Page Count | 75 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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