Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013
€173.74
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
€63.27
Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks (IEC 91/1191/CD:2014)
€105.42
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-18:2013); German version EN 61249-4-18:2013
€91.03
Space product assurance - Qualification of printed circuit boards; English version FprEN 16602-70-10:2014
€195.79
Space product assurance - Procurement of printed circuit boards; English version FprEN 16602-70-11:2014
€128.22
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013); German version EN 61249-4-19:2013
Device embedded substrate - Guidelines - Electrical testing (IEC 91/1138A/CD:2013)
€67.48
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
€111.40
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
€98.32
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
€69.91
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (IEC 91/1634/CD:2019); Text in German and English
