Materials for printed boards and other interconnecting structures -- Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad.
€67.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade.
€48.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).
€36.00
Base materials for printed circuits. Part 2: Specifications. Specification Nº 2: Phenolic cellulose paper copper-clad laminated sheet, econominc quality.
€41.00
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality.
Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
€65.00
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
€63.00
Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
€61.00
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 1 : guide for design and manufacturing of electronic assemblies - Technologies d'assemblage en électronique
€141.33
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 2 : guide for obtaining QML agreement for electronic boards - Technologies d'assemblage en électronique
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999
€84.58
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyimide film (IEC 61249-3-4:1999); German version EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad; cyanate ester non-woven aramid laminate of defined flammability, copper clad (IEC 61249-2-13:1999); German version EN 61249-2-13:1999
