Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-4 : matériaux de base renforcés plaqués et non plaqués - Feuille stratifiée en fibres de verre non tissées/tissées polyester, d'inflammabilité définie (essai de combustion verticale), plaquée cuivre
€95.67
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test methodology
€269.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1 : general test methods and methodology
€77.67
Quality assessment systems Registration and analysis of defects on printed board assemblies
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Polyester non-woven fibreglass laminated sheet of defined flammability (vertical burning test), copper
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper
€193.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001.
€84.58
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
€176.00
Printed boards - Part 1: Generic specification
€369.00
Materials for printed boards and other interconnecting structures - Part 2-12 : sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-3 : collection de spécifications intermédiaires pour les matériaux de base non renforcés, recouverts ou non (prévus pour les circuits imprimés flexibles) - Film flexible de polyester recouvert de colle
Materials for printed boards and other interconnecting structures - Part 3-4 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Adhesive coated flexible polyimide film
Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Transfer adhesive films
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-13 : collection de spécifications intermédiaires pour les matériaux de base renforcés, recouverts ou non de feuille conductrice - Stratifié à base d'aramide non tissé collé avec de la résine cyanate ester, recouvert de cuivre, d'inflammabilité définie
