Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-805 : essai à faible CDT X/Y par TMA pour matériaux de base minces
€77.67
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-3 : conception de la zone de report - Description de la zone de report pour les composants à trous traversants (THT)
€126.00
Materials for printed boards and other interconnecting structures - Part 2-12 : sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
€95.67
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-3 : collection de spécifications intermédiaires pour les matériaux de base non renforcés, recouverts ou non (prévus pour les circuits imprimés flexibles) - Film flexible de polyester recouvert de colle
Materials for printed boards and other interconnecting structures - Part 3-4 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Adhesive coated flexible polyimide film
Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Transfer adhesive films
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
€138.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2 : general test methods for materials and assemblies - Soldering Flux for printed board assemblies
€153.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4 : general test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for wire for printed board assembies
€111.67
Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
€148.67
Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
€150.65
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017.
€122.34
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017.
€105.42
Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 91/1467/CD:2017)
€111.40
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017.
