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DIN IEC/TS 62326-19*DIN SPEC 42326-19:2013-08
Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)
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Summary
Leiterplatten - Teil 19: Trägermaterial mit eingebetteten Bauteilen - Konstruktionsleitfaden (IEC 91/1084/CD:2013)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2013 |
| Page Count | 39 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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