Superseded
Draft standard
Historical
DIN EN 61189-5-3:2013-07
Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste (IEC 91/1071/CD:2012)
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Summary
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-3: Prüfverfahren für bestückte Leiterplatten: Lotpaste (IEC 91/1071/CD:2012)
Notes
Prévu pour remplacer DIN EN 61189-5 (2007-05, t).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2013 |
| Cancellation Date | 11/01/2015 |
| Page Count | 69 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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