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DIN IEC/TS 62326-17*DIN SPEC 42326-17:2013-07
Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)
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Summary
Leiterplatten - Teil 17: Trägermaterial mit eingebetteten Bauteilen - Testcoupons (IEC 91/1082/CD:2013)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 07/01/2013 |
| Page Count | 61 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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