Semiconductor devices - Mechanical and climatic test methods - Part 37 : board level drop test method using an accelerometer - Dispositifs à semiconducteurs
€111.67
Semiconductor devices. Mechanical and climatic test methods Board level drop method using an accelerometer
€193.00
Constant Current Electromigration Test (IEC 47/1954/CD:2008)
€84.58
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 47/1961/CD:2008)
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)
€116.64
Time Dependent Dielectric Breakdown Test (TDDB) for Inter-metal layers (IEC 47/1946/CD:2007)
€91.03
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for fine-pitch ball grid array and land (FBGA/FLGA)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
€127.00
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
€176.00
LED modules for general lighting - Safety specifications
€88.00
Semiconductor devices. Discrete devices Insulated-gate bipolar transistors (IGBTs)
€374.00
Semiconductor die products Questionnaire for users and suppliers
