31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 60749-20:2010-04

DIN EN 60749-20:2010-04

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009.

€111.40

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NF EN 60749-20, C96-022-20 (02/2010)

NF EN 60749-20, C96-022-20 (02/2010)

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat - Dispositifs à semiconducteurs

€111.67

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BS EN 60749-20:2009

BS EN 60749-20:2009

Superseded Historical

Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect moisture soldering heat

€269.00

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BS EN 60904-4:2009

BS EN 60904-4:2009

Superseded Historical

Photovoltaic devices Reference solar devices. Procedures for establishing calibration traceability

€269.00

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BS EN 62384:2006+A1:2009

BS EN 62384:2006+A1:2009

Superseded Historical

DC or AC supplied electronic control gear for LED modules. Performance requirements

€193.00

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IEC 60747-5-3:1997+AMD1:2002 Consolidated

IEC 60747-5-3:1997+AMD1:2002 Consolidated

Superseded Historical

Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods

€567.00

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DIN IEC 60115-2:2009-11

DIN IEC 60115-2:2009-11

Superseded Historical

Fixed resistors for use in electronic equipment - Part 2: Sectional specification - Fixed low-power non-wirewound resistors (IEC 40/2013/CD:2009)

€140.00

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DIN EN 60749-29:2009-11

DIN EN 60749-29:2009-11

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/2026/CDV:2009); German version FprEN 60749-29:2009

€111.40

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DIN EN 60749-19/A1:2009-10

DIN EN 60749-19/A1:2009-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009

€41.78

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DIN EN 60749-30/A1:2009-10

DIN EN 60749-30/A1:2009-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2019/CDV:2009); German version EN 60749-30:2005/FprA1:2009

€48.79

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DIN EN 60749-7:2009-10

DIN EN 60749-7:2009-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2021/CDV:2009); German version FprEN 60749-7:2009

€69.91

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DIN EN 62258-2:2009-10

DIN EN 62258-2:2009-10

Superseded Historical

Semiconductor die products - Part 2: Exchange data formats (IEC 47/2023/CDV:2009); English version FprEN 62258-2:2009

€185.05

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DIN EN 60749-21:2009-10

DIN EN 60749-21:2009-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009

€105.42

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DIN EN 60749-34:2009-10

DIN EN 60749-34:2009-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 47/2027/CDV:2009); German version FprEN 60749-34:2009

€63.27

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DD IEC/PAS 62612:2009

DD IEC/PAS 62612:2009

Withdrawn Most Recent

Self-ballasted LED-lamps for general lighting services. Performance requirements

€193.00

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