LCD backlight unit - Part 1-2 : terminology and letter symbols
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Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
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Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes (IEC 47/2122/CDV:2012); German version FprEN 62483:2012
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Semiconductor devices. Discrete devices Isolated power semiconductor
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Hand-held motor-operated electric tools. Safety Particular requirements for sanders and polishers other than disk type
€193.00
Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic reinforced isolation
€316.00
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€48.00
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011.
€84.58
IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
€286.00
Semiconductor devices - Mechanical and climatic test methods - Part 30 : preconditioning of non-hermetic surface mount devices prior to reliability testing - Dispositifs à semiconducteurs
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Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 47/2107/CDV:2011); German version EN 60749-27:2006/FprA1:2011
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Standard Guide for Neutron Irradiation of Unbiased Electronic Components
