31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 60747-16-1/A2:2015-07

DIN EN 60747-16-1/A2:2015-07

Superseded Historical

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 47E/500/CDV:2015); German version EN 60747-16-1:2002/FprA2:2015

€63.27

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BS EN 60747-5-5:2011+A1:2015

BS EN 60747-5-5:2011+A1:2015

Superseded Historical

Semiconductor devices. Discrete devices Optoelectronic Photocouplers

€374.00

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DIN EN 62951-1:2015-06

DIN EN 62951-1:2015-06

Withdrawn Most Recent

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2224/CD:2015)

€84.58

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NF EN 62031/A2, C71-250/A2 (06/2015)

NF EN 62031/A2, C71-250/A2 (06/2015)

Superseded Historical

LED modules for general lighting - Safety specifications - Modules de DEL pour éclairage général

€77.67

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UNE-EN 62031:2009/A2:2015

UNE-EN 62031:2009/A2:2015

Superseded Historical

LED modules for general lighting - Safety specifications

€41.00

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IEC 62047-15:2015

IEC 62047-15:2015

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

€44.00

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BS EN 62031:2008+A2:2015

BS EN 62031:2008+A2:2015

Superseded Historical

LED modules for general lighting. Safety specifications

€269.00

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IEC 62031:2008/AMD2:2014

IEC 62031:2008/AMD2:2014

Superseded Historical

Amendment 2 - LED modules for general lighting - Safety specifications

€11.00

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IEC 62031:2008+AMD1:2012+AMD2:2014 Consolidated

IEC 62031:2008+AMD1:2012+AMD2:2014 Consolidated

Superseded Historical

LED modules for general lighting - Safety specifications

€220.00

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DIN EN 62830-3:2014-09

DIN EN 62830-3:2014-09

Withdrawn Most Recent

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting (IEC 47/2198/CD:2014)

€105.42

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NF EN 62572-3, C93-882-3 (09/2014)

NF EN 62572-3, C93-882-3 (09/2014)

Superseded Historical

Composants et dispositifs actifs en fibres optiques - Normes de fiabilité - Partie 3 : modules laser utilisés pour les télécommunications

€111.67

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NF EN 60749-26, C96-022-26 (09/2014)

NF EN 60749-26, C96-022-26 (09/2014)

Superseded Historical

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26 : essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)

€166.33

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DIN EN 60749-44:2014-08

DIN EN 60749-44:2014-08

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)

€105.42

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DIN EN 62880-1:2014-08

DIN EN 62880-1:2014-08

Withdrawn Most Recent

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)

€128.22

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BS EN 60749-26:2014

BS EN 60749-26:2014

Superseded Historical

Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)

€316.00

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