Superseded
Standard
Historical
IEC 60749-37:2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Preview
Summary
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/30/2008 |
| Release Date | 01/30/2008 |
| Cancellation Date | 10/12/2022 |
| Edition | 1 |
| Page Count | 39 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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