Normalisation mécanique des dispositifs à semiconducteurs - Partie 6 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface
€125.00
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages
€316.00
Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
€111.40
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€88.00
Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors (IEC 47E/265/CD:2004)
€364.11
Dispositifs à semiconducteurs - Partie 15 : dispositifs à semiconducteurs de puissance isolée
€150.67
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for non-hermetic encapsulated electronic components (IEC 47/1769/CD:2004)
€98.32
Semiconductors Product - Discontinuance notification for semiconductors (IEC 47/1777A/CDV:2004)
€41.78
Specification for safety of household and similar electrical appliances Particular requirements tumble dryers
€193.00
Board level drop test method of components for handheld electronic products
€127.00
Semiconductor devices - Discrete devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 47E/264/CD:2004)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004); German version EN 60749-23:2004.
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2004); German version EN 60749-34:2004.
€69.91
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
€286.00
