Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006
€98.32
Varnishes used for electrical insulation Methods of test
€269.00
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
€63.27
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
€56.17
Amendment 1 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
€127.00
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006); German version EN 62373:2006
€69.91
Semiconductor devices - Mechanical and climatic test methods - Part 35 : acoustic microscopy for plastic encapsulated electronic components - Dispositifs à semiconducteurs
€95.67
Semiconductor die products - Part 6 : requirements for information concerning thermal simulation
€34.07
Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM) - Dispositifs à semiconducteurs
€77.96
Produits de matrice de semi-conducteur - Partie 5 : exigences pour l'information concernant la simulation électrique
€65.66
Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
€165.00
Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
Semiconductor die products Requirements for information concerning electrical simulation
€193.00
Semiconductor die products Requirements for information concerning thermal simulation
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
