Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
€61.00
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
€51.00
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
€65.00
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
€137.00
Automatic electrical controls for household and similar use General requirements
€404.00
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003.
€77.20
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages Dimensions P-VSON
€193.00
Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€44.00
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
€69.00
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
€36.00
Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
€32.00
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-10 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON
€77.67
