Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions ball grid array (BGA)
€193.00
Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state - Dispositifs à semiconducteurs
€43.67
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
€59.33
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
€88.00
Semiconductor devices. Mechanical and climatic test methods General
€165.00
Semiconductor devices. Mechanical and climatic test methods Bond strength
€269.00
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices. Mechanical and climatic test methods Sealing
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
€153.00
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
€125.00
Semiconductor devices - Mechanical and climatic test methods - Part 16 : particle impact noise dectection (PIND) - Dispositifs à semiconducteurs
Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€44.00
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
€48.00
