Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€176.00
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
€286.00
Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
€22.00
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
€165.00
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
€61.00
Low voltage surge protective devices Specifications for avalanche breakdown diode (ABD)
€193.00
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
€44.00
Data requirements for semiconductor die. Particular and recommendations die types Minimally-packaged
Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode (ABD)
€88.00
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
€325.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
