Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
€165.00
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
€22.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
€193.00
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€88.00
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
€44.00
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Data requirements for semiconductor die. Particular and recommendations die types Bare
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures
Data requirements for semiconductor die. Exchange data formats and dictionary
€269.00
Discrete semiconductor devices and integrated circuits. Semiconductor devices. sensors Hall elements
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
€86.33
Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
€231.00
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
