Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced) - Dispositifs à semiconducteurs
€28.00
Semiconductor devices - Mechanical and climatic test methods - Part 1 : general - Dispositifs à semiconducteurs
€59.33
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
€95.67
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
€193.00
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
€165.00
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
€59.00
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
€56.17
American National Standard for Measurement Procedures for Resolution and Efficiency of Wide-Bandgap Semiconductor Detectors of Ionizing Radiation
€99.00
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
€0.00
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
€88.00
