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Standard Corrigendum
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IEC 60749-8:2002/COR2:2003
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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Summary
Modification of the validity date: now put at 2007.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/12/2003 |
| Release Date | 08/12/2003 |
| Edition | 1 |
| Page Count | 0 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Replaced by
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30/08/2002
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