31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60749-27:2006/AMD1:2012

IEC 60749-27:2006/AMD1:2012

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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

€11.00

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IEC 60749-27:2006+AMD1:2012 Consolidated

IEC 60749-27:2006+AMD1:2012 Consolidated

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Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

€171.00

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IEC TR 62258-4:2012

IEC TR 62258-4:2012

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Semiconductor die products - Part 4: Questionnaire for die users and suppliers

€127.00

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NF EN 60749-29, C96-022-29 (08/2012)

NF EN 60749-29, C96-022-29 (08/2012)

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Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test - Dispositifs à semiconducteurs

€93.91

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NF EN 62047-12, C96-050-12 (07/2012)

NF EN 62047-12, C96-050-12 (07/2012)

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Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures - Dispositifs à semiconducteurs

€93.91

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NF EN 60747-16-4/A1, C96-016-4/A1 (07/2012)

NF EN 60747-16-4/A1, C96-016-4/A1 (07/2012)

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Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches

€77.96

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DIN EN 62047-12:2012-06

DIN EN 62047-12:2012-06

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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011

€116.64

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NF EN 60749-23/A1, C96-022-23/A1 (06/2012)

NF EN 60749-23/A1, C96-022-23/A1 (06/2012)

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Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life - Dispositifs à semiconducteurs

€28.06

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NF EN 60749-21, C96-022-21 (06/2012)

NF EN 60749-21, C96-022-21 (06/2012)

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Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability - Dispositifs à semiconducteurs

€82.01

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BS EN 62047-13:2012

BS EN 62047-13:2012

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Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

€193.00

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BS EN 62047-14:2012

BS EN 62047-14:2012

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Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials

€193.00

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NF EN 62047-5, C96-050-5 (05/2012)

NF EN 62047-5, C96-050-5 (05/2012)

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Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 5 : commutateurs MEMS-RF

€138.19

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NF EN 62047-9, C96-050-9 (04/2012)

NF EN 62047-9, C96-050-9 (04/2012)

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Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs

€93.91

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IEC 62047-5:2011/COR1:2012

IEC 62047-5:2011/COR1:2012

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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

€0.00

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IEC 62047-9:2011/COR1:2012

IEC 62047-9:2011/COR1:2012

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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

€0.00

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