31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60749-42:2014

IEC 60749-42:2014

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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

€22.00

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NF EN 60191-4, C96-013-4 (08/2014)

NF EN 60191-4, C96-013-4 (08/2014)

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Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages

€111.96

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IEC 62047-20:2014

IEC 62047-20:2014

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Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

€369.00

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IEC 62047-21:2014

IEC 62047-21:2014

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Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

€88.00

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IEC 62047-22:2014

IEC 62047-22:2014

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Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

€44.00

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DIN EN 62047-11:2014-04

DIN EN 62047-11:2014-04

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Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013

€105.42

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DIN EN 62047-18:2014-04

DIN EN 62047-18:2014-04

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Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013

€91.03

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NF EN 62047-11, C96-050-11 (03/2014)

NF EN 62047-11, C96-050-11 (03/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs

€95.67

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NF EN 62047-19, C96-050-19 (03/2014)

NF EN 62047-19, C96-050-19 (03/2014)

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Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19 : compas électroniques

€93.91

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NF EN 62047-18, C96-050-18 (02/2014)

NF EN 62047-18, C96-050-18 (02/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs

€95.67

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NF EN 60747-16-5, C96-016-5 (02/2014)

NF EN 60747-16-5, C96-016-5 (02/2014)

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Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators

€117.24

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BS EN 62047-11:2013

BS EN 62047-11:2013

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Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion free-standing materials micro-electromechanical systems

€269.00

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BS EN 62047-18:2013

BS EN 62047-18:2013

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Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials

€193.00

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BS IEC 62483:2013

BS IEC 62483:2013

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Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

€374.00

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BS EN 62047-19:2013

BS EN 62047-19:2013

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Semiconductor devices. Micro-electromechanical devices Electronic compasses

€316.00

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