Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
€176.00
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
€325.00
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
€23.00
Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
€82.01
IEC/IEEE Test methods for the characterization of organic transistors and materials
€203.00
IEC/IEEE Test methods for the characterization of organic transistor-based ring oscillators
€143.00
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
€127.00
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
€88.00
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
€231.00
Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes
€286.00
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices - Dispositifs à semi-conducteurs
€93.91
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
€111.96
Semiconductor devices. Micro-electromechanical devices RF MEMS switches
€316.00
