Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide packages Silicon Fine-pitch Ball Grid Array and Land (S-FBGA S-FLGA)
€193.00
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012.
€91.03
Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM) - Dispositifs à semiconducteurs
€43.95
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
€77.96
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
€269.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-16 : glossaire des supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
€127.00
Semiconductor devices - Micro-electromechanical devices - Part 14 : forming limit measuring method of metallic film materials - Dispositifs à semiconducteurs
€95.67
Semiconductor devices - Micro-electromechanical devices - Part 13 : bend - and shear - type test methods of measuring adhesive strenght for MEMS structures - Dispositifs à semiconducteurs
Semiconductor devices - Micro-electromechanical devices - Part 10 : micro-pillar compression test for MEMS materials - Dispositifs à semiconducteur
Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€176.00
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-17 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers empilés - Boîtiers matriciels à billes et à pas fins et boîtiers matriciels à zone de contact plate et à pas fins (P-PFBGA et P-PFLGA)
€111.96
