Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control selection
€316.00
Semiconductor devices. Mechanical and climatic test methods Solderability
€269.00
Semiconductor devices. Mechanical and climatic test methods Latch-up
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guidelines fine-pitch land grid array (FLGA)
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
€43.95
Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Semiconductor die products Exchange data formats
€404.00
Semiconductor devices Generic specification for discrete and integrated circuits
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
€44.00
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
€61.00
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
€286.00
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
€176.00
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011.
€77.20
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide stacked Fine-pitch ball grid array and fine-pitch land (P-PFBGA P-PFLGA)
