31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
IEC 60749-29:2011

IEC 60749-29:2011

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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

€176.00

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BS EN 60749-32:2003+A1:2010

BS EN 60749-32:2003+A1:2010

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Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (externally induced)

€165.00

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IEC 62047-8:2011

IEC 62047-8:2011

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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

€127.00

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DIN EN 62047-4:2011-03

DIN EN 62047-4:2011-03

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Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

€105.42

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NF EN 62418, C80-204 (03/2011)

NF EN 62418, C80-204 (03/2011)

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Dispositifs à semi-conducteurs - Essai sur les cavités dues aux contraintes de la métallisation

€95.67

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BS IEC 60747-14-4:2011

BS IEC 60747-14-4:2011

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Semiconductor devices. Discrete devices accelerometers

€404.00

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BS EN 60749-34:2010

BS EN 60749-34:2010

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Semiconductor devices. Mechanical and climatic test methods Power cycling

€165.00

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BS EN 60745-1:2009+A11:2010

BS EN 60745-1:2009+A11:2010

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Hand-held motor-operated electric tools. Safety General requirements

€404.00

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IEC 60747-14-4:2011

IEC 60747-14-4:2011

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Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

€446.00

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IEC 60191-6-17:2011

IEC 60191-6-17:2011

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Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

€231.00

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UNE-EN 60749-19:2003/A1:2011

UNE-EN 60749-19:2003/A1:2011

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Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

€32.00

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UNE-EN 60749-32:2004/A1:2011

UNE-EN 60749-32:2004/A1:2011

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Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

€36.00

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DIN EN 60749-19:2011-01

DIN EN 60749-19:2011-01

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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010.

€56.17

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DIN EN 60749-32:2011-01

DIN EN 60749-32:2011-01

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010.

€56.17

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BS EN 60191-6-20:2010

BS EN 60191-6-20:2010

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Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Measuring methods package dimensions small J-lead packages (SOJ)

€193.00

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