Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide ball grid array (BGA)
€269.00
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
€44.00
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
€88.00
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 6 : méthodes d'essais de fatigue axiale des matériaux en couche mince
€95.67
Semiconductor devices. Metallization stress void test
€193.00
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Semiconductor devices - Part 1: General
€567.00
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
€369.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)
€82.01
Semiconductor devices. Hot carrier test on MOS transistors
€165.00
Semiconductor devices General
€355.00
Semiconductor devices. Constant current electromigration test
High-voltage direct current (HVDC) installations - System tests
€418.00
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
€11.00
