31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
BS EN IEC 63378-6:2026

BS EN IEC 63378-6:2026

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Thermal standardization on semiconductor packages resistance and capacitance model for transient temperature prediction at junction measurement points

€316.00

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BS IEC 62047-52:2026

BS IEC 62047-52:2026

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Semiconductor devices - Micro-electromechanical Part 52: Biaxial tensile testing method for stretchable MEMS

€193.00

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BS EN IEC 60749-20-1:2026

BS EN IEC 60749-20-1:2026

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Semiconductor devices ? Mechanical and climatic test methods Part 20-1: Handling, packing, labelling shipping of surface-mount sensitive to the combined effect moisture soldering heat

€316.00

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IEC 62047-52:2026

IEC 62047-52:2026

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Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS

€88.00

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NF EN IEC 60749-22-1 (03/2026)

NF EN IEC 60749-22-1 (03/2026)

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Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 22-1 : Robustesse des contacts soudés - Méthodes d’essais d’arrachement par traction des contacts soudés par fil

€141.50

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NF EN IEC 60749-22-2 (03/2026)

NF EN IEC 60749-22-2 (03/2026)

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Dispositifs à semiconducteurs - Méthodes d’essais mécaniques et climatiques - Partie 22-2 : Robustesse des contacts soudés - Méthodes d’essais de cisaillement des contacts soudés par fil

€97.00

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NF EN IEC 60749-20-1 (03/2026)

NF EN IEC 60749-20-1 (03/2026)

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Dispositifs à semi-conducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage

€117.00

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NF EN IEC 60749-26 (03/2026)

NF EN IEC 60749-26 (03/2026)

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Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26 : Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)

€116.50

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BS IEC 63602:2026

BS IEC 63602:2026

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Guidelines for representing switching losses of SIC MOSFETs in datasheets

€193.00

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BS EN IEC 60749-26:2026

BS EN IEC 60749-26:2026

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Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)

€374.00

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IEC 62031:2026

IEC 62031:2026

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LED modules - Safety requirements

€88.00

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26/30544420 DC:2026

26/30544420 DC:2026

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BS EN IEC 62047-58 Semiconductor devices - Micro-electromechanical systems Part 58: Test methods for performances of MEMS thermopile

€23.00

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26/30544424 DC:2026

26/30544424 DC:2026

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Draft BS EN 62047-59 Ed.1.0 Micro-electromechanical systems Part 59: Test methods for performances of MEMS multi-orifice balanced differential pressure flowmeter

€23.00

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BS IEC 63601:2026

BS IEC 63601:2026

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Guideline for evaluating bias temperature instability of silicon carbide metal-oxide-semiconductor devices for power electronic conversion

€355.00

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IEC 63602:2026

IEC 63602:2026

Active Most Recent

Guidelines for representing switching losses of SIC MOSFETs in datasheets

€88.00

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