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BS EN IEC 60749-20-1:2026
Semiconductor devices ? Mechanical and climatic test methods Part 20-1: Handling, packing, labelling shipping of surface-mount sensitive to the combined effect moisture soldering heat
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/09/2026 |
| Page Count | 44 |
| Themes | Packaging |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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