Active
Standard
Most Recent
BS EN IEC 63378-6:2026
Thermal standardization on semiconductor packages resistance and capacitance model for transient temperature prediction at junction measurement points
No description.
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 03/24/2026 |
| Page Count | 34 |
| Themes | Capacitance measurement |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
No products.