Design guide outdoor enclosures (IEC 48D/178/CDV:1998); German version prEN 61969-1:1998
€69.91
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
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Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
€127.00
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
€88.00
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€325.00
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
€176.00
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
€231.00
Semiconductor devices, mechanical standardization - QFP measuring method (IEC 47D/221/CDV:1998)
€91.03
Semiconductor devices, mechanical standardization - 4, 5 and 6 leaded SMD (Body size D × E: 2,0 mm × 1,25 mm) (IEC 47D/222/CD:1998)
€84.58
Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/151/CDV:1998)
€56.17
IEC 60368-3: Piezoelectric filters - Part 3: Standard outlines (IEC 49/400/CD:1997)
IEC 60679-3: Quartz crystal controlled oscillators - Part 3: Standard outlines and lead connections (IEC 49/401/CD:1997)
€116.64
Sectional specification for outdoor enclosures (IEC 48D/142/CD:1997)
€41.78
Detail specification for cabinets - Outdoor enclosures (IEC 48D/143/CD:1997)
€34.30
