Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-VQFN (IEC 47D/483/CDV:2002); German version prEN 60191-6-7:2002
€69.91
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002.
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 49/610/CDV:2003); German version prEN 61837-4:2003
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/310/CD:2004)
€63.27
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions for subracks and plug-in units (IEC 48D/304/CD:2004)
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type I (IEC 47D/169/CDV:1997)
€48.79
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)
Semiconductor devices, mechanical standardization - Power package - HSOP (IEC 47D/186/CDV:1997)
€41.78
Semiconductor devices, mechanical standardization - Proposal for a Glass sealed ceramic Qaud Flat Package (G-QFP) family (IEC 47D/131/CD:1996)
Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)
Semiconductor devices, mechanical standardization - Proposed addition to the metric plastic quad flatpack family 1,0 - 133E, 0,80 - 134E und 0,65 - 135E (Intended for inclusion into IEC 60191-2) (IEC 47D/147/CD:1996)
€91.03
Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)
€98.32
Semiconductor devices, mechanical standardization - 3-leaded SMD outline package (Body size D × E: 1,60 mm × 0,8 mm) (IEC 47D/196/CD:1997)
Semiconductor devices, mechanical standardization - Ceramic land grid array 1,0/0,8 mm pitch family (IEC 47D/197/CD:1997)
Semiconductor devices, mechanical standardization - SON (Small Outline Non-Leaded Packages), 0,50 mm pitch family (IEC 47D/199/CD:1997)
