Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
€69.91
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)
€122.34
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
€111.40
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification; Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 61969-3:2001); German version EN 61969-3:2001.
€77.20
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
€34.30
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001); German version EN 60191-4:1999 + A1:2002.
€91.03
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:1999); German version EN 61587-1:1999.
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:1999); German version EN 61837-1:1999.
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard (IEC 60917-1:1998); German version EN 60917-1:1998.
Amendement 1 - Structures mécaniques pour les équipements électriques et électroniques - Essais pour les séries IEC 60917 et IEC 60297 - Partie 1 : Exigences environnementales, montages d'essai et aspects liés à la sécurité
€27.50
Draft IEC 61969-3: Outdoor enclosures - Part 3: Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 48D/193/CD:1999)
€48.79
Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
€84.58
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2-3 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Spécification particulière étendue - Dimensions pour bacs, châssis, fonds de panier, faces avant et unités enfichables
€131.33
Structures mécaniques pour équipements électroniques - Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) - Partie 3-102: Poignée d'injecteur/d'extracteur
€80.50
Structures mécaniques pour équipements électriques et électroniques - Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) - Partie 3-101: Bacs et blocs enfichables associés
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