Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1. (IEC 48D/391/CDV:2009); German version FprEN 60297-3-106:2009
€91.03
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 48D/392/CDV:2009); German version FprEN 60917-2-4:2009
€84.58
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (IEC 48D/398/CD:2009)
€69.91
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements and tests, safety aspects (IEC 48D/399/CD:2009)
Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (IEC 48D/397/CD:2009)
Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
€111.40
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007); German version EN 61587-1:2007.
€105.42
Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
€128.22
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/906/CD:2010)
€116.64
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Mechanical structures for electronic equipment - Part 3-107: Dimensions of subracks and plug-in units, micro format (IEC 48D/429/CD:2010)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)
€41.78
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
€98.32
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; Interface co-ordination dimensions for the 25 mm equipment practice; Section 3: Extended detail specification; Dimensions for subracks chassis, backplanes, front panels, and plug-in units (IEC 48D/285/CD:2003)
