Detail specification for cases - Outdoor enclosures (IEC 48D/144/CD:1997)
€48.79
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units; additional dimensions (IEC 48D/139/CDV:1997)
€41.78
Fin-pitch Ball-Grid-Array- and Land-Grid-Array 0,80 mm, 0,65 mm, 0,50 mm or 0,40 mm pitch family (IEC 47D/195/CD:1997)
€63.27
SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)
€111.40
Semiconductor devices, mechanical standardization - 3-leaded SMD outline package (Body size D × E: 1,60 mm × 0,8 mm) (IEC 47D/196/CD:1997)
Semiconductor devices, mechanical standardization - Ceramic land grid array 1,0/0,8 mm pitch family (IEC 47D/197/CD:1997)
Semiconductor devices, mechanical standardization - SON (Small Outline Non-Leaded Packages), 0,50 mm pitch family (IEC 47D/199/CD:1997)
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
€88.00
Packging of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes
€127.00
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G
€44.00
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES.
€30.00
Semiconductor devices, mechanical standardization - Power package - HSOP (IEC 47D/186/CDV:1997)
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type I (IEC 47D/169/CDV:1997)
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)
