31.240 : Mechanical structures for electronic equipment

DIN IEC 47D/195/CD:1998-02

DIN IEC 47D/195/CD:1998-02

Superseded Historical

Fin-pitch Ball-Grid-Array- and Land-Grid-Array 0,80 mm, 0,65 mm, 0,50 mm or 0,40 mm pitch family (IEC 47D/195/CD:1997)

€63.27

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DIN IEC 47D/198/CD:1998-02

DIN IEC 47D/198/CD:1998-02

Withdrawn Most Recent

SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)

€111.40

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DIN IEC 48D/139/CDV:1998-03

DIN IEC 48D/139/CDV:1998-03

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units; additional dimensions (IEC 48D/139/CDV:1997)

€41.78

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DIN IEC 48D/143/CD:1998-04

DIN IEC 48D/143/CD:1998-04

Superseded Historical

Detail specification for cabinets - Outdoor enclosures (IEC 48D/143/CD:1997)

€34.30

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DIN IEC 48D/144/CD:1998-04

DIN IEC 48D/144/CD:1998-04

Superseded Historical

Detail specification for cases - Outdoor enclosures (IEC 48D/144/CD:1997)

€48.79

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DIN EN 60191-6:2005-04

DIN EN 60191-6:2005-04

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004.

€122.34

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DIN IEC 60749-39:2005-04

DIN IEC 60749-39:2005-04

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits (IEC 47/1797/CD:2004)

€69.91

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DIN IEC 60191-1:2005-06

DIN IEC 60191-1:2005-06

Superseded Historical

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005)

€122.34

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DIN EN 60191-6-13:2005-07

DIN EN 60191-6-13:2005-07

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005

€84.58

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DIN EN 60191-6-16:2005-07

DIN EN 60191-6-16:2005-07

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA (IEC 47D/621/CDV:2005); German version prEN 60191-6-16:2005

€84.58

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DIN IEC 47D/72/CD:1995-11

DIN IEC 47D/72/CD:1995-11

Superseded Historical

Semiconductor devices, mechanical standardization - IEC 60191-3: Requirements for pin 1 mark function and location adding PLCC figure 19 and QFP figure 20 (IEC 47D/72/CD:1995)

€41.78

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DIN IEC 47D/73/CD:1995-11

DIN IEC 47D/73/CD:1995-11

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposal for a definition of pin 1 orientation for TAB-packages (intended for inclusion into IEC 60191-3) (IEC 47D/73/CD:1995)

€41.78

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DIN IEC 48D/89/CD:1995-11

DIN IEC 48D/89/CD:1995-11

Superseded Historical

Mechanical aspects/climatic tests for cabinets, racks and subracks (IEC 48D/89/CD:1995)

€91.03

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DIN IEC 48D/90/CD:1995-11

DIN IEC 48D/90/CD:1995-11

Superseded Historical

Seismic tests for cabinets and racks (IEC 48D/90/CD:1995)

€48.79

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DIN IEC 48D/91/CD:1995-11

DIN IEC 48D/91/CD:1995-11

Superseded Historical

Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/91/CD:1995)

€56.17

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