Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 5: Subracks and associated plug-in for EMC, ESD, injector/extractor and keying (IEC 48D/119/CD:1997)
€91.03
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT. DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES. PART 4: SUBRACKS AND ASSOCIATED PLUG-IN UNITS. ADDITIONAL DIMENSIONS.
€65.00
Semiconductor devices, mechanical standardization - Proposed addition to the metric plastic quad flatpack family 1,0 - 133E, 0,80 - 134E und 0,65 - 135E (Intended for inclusion into IEC 60191-2) (IEC 47D/147/CD:1996)
Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)
€98.32
Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)
€41.78
Semiconductor devices, mechanical standardization - Proposal for a Glass sealed ceramic Qaud Flat Package (G-QFP) family (IEC 47D/131/CD:1996)
€63.27
Semiconductor devices, mechanical standardization - Plastic Ball Grid Array Outline Family (PBGA) (IEC 47D/106/CDV:1996)
€56.17
Semiconductor devices, mechanical standardization - Plastic Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/108/CD:1996)
Semiconductor devices, mechanical standardization - Plastic Thin Shrink Small Outline Package (TSSOP/HTSSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/109/CD:1996)
Standard outlines of surface mounted devices (SMD) for frequency control and selection (IEC 49/338/CD:1996)
€122.34
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package J-lead (P-SOJ), 7,62 mm body-family (IEC 47D/104/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package J-lead (P-SOJ), 10,16 mm body-family (IEC 47D/105/CD:1996)
€48.79
Semiconductor devices, mechanical standardization - Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2 (IEC 47D/112/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a plastic thin small package P-TSOP II, 7,62 mm body family (if approved to be included in IEC 60191-2) (IEC 47D/113/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package P-TSOP II, 10,16 mm body family (intended for inclusion into IEC 60191-2) (IEC 47D/114/CD:1996)
