Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
€41.78
Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
Semiconductor devices, mechanical standardization; Amendment 2 to IEC 60191-2 (IEC 47D/58/CDV:1995)
Semiconductor devices, mechanical standardization; inclusion of three packages for power modules in IEC 191-2 (IEC 47D(Secretariat)7:1993)
€48.79
Semiconductor devices; mechanical standardization; designation system for semiconductor outlines (IEC 47D(Secretariat)5:1993)
€91.03
Semiconductor devices, mechanical standardization; transistor outline of form E; supplement to IEC 60191-2 (IEC 47D(Secretariat)13:1993)
Semiconductor devices; blank detail specification for field effect transistors for case-rated switching applications (IEC 47(Central Office)1350:1993)
Semiconductor devices; mechanical standardization; proposal for DAMBAR protusion and intrusion at terminals (IEC 47D(Secretariat)14:1993)
Semiconductor devices, mechanical standardization; proposal for addition of a dual in line package with 56 terminals to the outline family 101G (IEC 47(Secretariat)1137:1991)
Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3: Subracks and associated plug-in units (IEC 60297-3:1984 + A1:1992); German version HD 493.3 S2:1993.
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/838/CD:2009)
€98.32
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/839/CD:2009)
€116.64
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 49/840/CD:2009)
€111.40
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/845/CD:2009)
€248.22
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Sectional specification; coordination dimensions for cases and cabinets (IEC 61969-2:2000); German version EN 61969-2:2000.
€56.17
