Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 119E (IEC 47D/331/CDV:1999)
€63.27
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Standard overall package height; Amendment 1 to IEC 60191-4 (IEC 47D/362/CD:2000)
€34.30
Amendment 2 to IEC 60191-6: Mechanical standardization of semiconductor devices - Pin grid array 2,54 mm pitch outline family (Intended for inclusion into IEC 60191-2) (IEC 47D/332/CD:1999)
€48.79
Semiconductor devices, mechanical standardization, 3-Leaded SMD (Body Size D x E: 2.9 x 1.5 mm) outline family 162 E (IEC 47D/440/FDIS:2001)
General design guideline for rectangular FBGA packages (IEC 47D/394/CDV:2000)
€91.03
Line Replaceable Integrated Electronics Chassis Standard
€27.50
Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
This product is not for sale, please contact us for more information
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
Standard Specification for Integrated Circuit Lead Frame Material
Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
Terminology Relating to Measurements Taken on Thin, Reflecting Films
