Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices (Withdrawn 2023)
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Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications (Withdrawn 2024)
Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage
€23.00
BS EN IEC 61760-1 Surface mounting technology Part 1: Standard method for the specification of surface components (SMDs)
Practice for Determining Hydrolytic Stability of Plastic Encapsulants for Electronic Devices (Withdrawn 1994)
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
Method of determining enclosure thermal performance by the influence of internal heat load and sun radiation (IEC 48D/262/CD:2001)
€91.03
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment A2 (IEC 47D/452/CDV:2001); German version EN 60191-4:1999/prA2:2001
€41.78
Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
€128.22
Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
Proposal for 60 and 90 Pin P-FBGA (Plastic Fine pitch Ball Grid Array) 0,8 mm (IEC 47D/316A/CD:1999)
Tape ball grid array package, 0,6 mm ball diameter family (IEC 47D/314A/CD:1999)
Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 102E (IEC 47D/330/CDV:1999)
€63.27
