IEC 60917-2-3:2006 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
€302.00
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
€46.00
IEC TS 62610-1:2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
€186.00
IEC TS 62610-3:2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect)
€244.00
Structures mécaniques pour les équipements électriques et électroniques - Essais pour les séries IEC 60917 et IEC 60297 - Partie 1 : exigences environnementales, montages d'essai et aspects liés à la sécurité
€128.67
Emballage de composants pour opérations automatisées - Partie 3 : emballage des composants pour montage en surface en bandes continues
€141.33
