31.240 : Mechanical structures for electronic equipment

IEC TR 60297-3-1:2023

IEC TR 60297-3-1:2023

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IEC TR 60297-3-1:2023 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-1: Technological schemes and applications

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IEC 63098-4:2023

IEC 63098-4:2023

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IEC 63098-4:2023 Transmitting and receiving equipment for radiocommunication - Radio-over-fibre technologies and their performance standard - Part 4: Radio-over-fibre-based indoor distributed antenna system (DAS) for 5G

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IEC TR 60297-3-1:2023/COR1:2025

IEC TR 60297-3-1:2023/COR1:2025

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IEC TR 60297-3-1:2023/COR1:2025 Corrigendum 1 - Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-1: Technological schemes and applications

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IEC 61191-2:2017/COR1:2019

IEC 61191-2:2017/COR1:2019

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IEC 61191-2:2017/COR1:2019 Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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IEC 62610-6:2020

IEC 62610-6:2020

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IEC 62610-6:2020 Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 6: Air recirculation and bypass of indoor cabinets

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IEC 62739-3:2017

IEC 62739-3:2017

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IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

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IEC 61587-6:2017

IEC 61587-6:2017

Superseded Historical

IEC 61587-6:2017 Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets

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IEC 61191-2:2017

IEC 61191-2:2017

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IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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IEC 61191-3:2017

IEC 61191-3:2017

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IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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IEC 61191-4:2017

IEC 61191-4:2017

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IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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IEC 60286-1:2017

IEC 60286-1:2017

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IEC 60286-1:2017 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

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IEC 60297-3-101:2004

IEC 60297-3-101:2004

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IEC 60297-3-101:2004 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-101: Subracks and associated plug-in units

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IEC 60297-3-103:2004

IEC 60297-3-103:2004

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IEC 60297-3-103:2004 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-103: Keying and alignment pin

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IEC 60297-3-102:2004

IEC 60297-3-102:2004

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IEC 60297-3-102:2004 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-102: Injector/extractor handle

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IEC 61760-1:2006

IEC 61760-1:2006

Superseded Historical

IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

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