IEC 60917-2:1992 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
€133.00
IEC 60297-3-110:2018 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-110: Residential racks and cabinets for smart houses
IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€342.00
Emballage des composants pour opérations automatisées - Partie 3-1 : emballage des composants appropriés au montage en surface en bandes continues - Type V : bandes porteuses pressées
€93.33
Emballage de composants pour opérations automatisées - Partie 3-2 : emballage des composants appropriés au montage en surface en bandes continues - Type VI - Bandes porteuses à cloques de 4 mm de large
€76.00
Dimensions des structures mécaniques de la série de 482,6 mm (19 in) - Première partie : panneaux et bâtis
€43.67
Dimensions des structures mécaniques de la série de 482,6 mm (19 in) - Deuxième partie : armoires et pas des structures
€34.00
Dimensions des structures mécaniques de la série de 482,6 mm (19 in) - Troisième partie : bacs et blocs enfichables associés
€86.50
IEC 60917-2-1:1993 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabinets and racks
€46.00
IEC 60917-2-2:1994 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
€302.00
Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/671/CD:2006)
€84.58
Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
€91.03
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 61587-3:2006); German version EN 61587-3:2006.
€77.20
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 48D/354/CD:2007)
€69.91
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 48D/355/CD:2007)
