Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999); German version EN 60191-4:1999.
€91.03
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 4: Subracks and associated plug-in units - Additional dimensions
€32.00
Structures mécaniques pour équipement électronique - Essais pour la IEC 60917 et la IEC 60297 - Partie 1 : essais climatiques, mécaniques et aspects de la sécurité des baies, bâtis, bacs à cartes et châssis
€111.67
Amendment 1 - Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
€11.00
Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 102E (IEC 47D/330/CDV:1999)
€63.27
Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 119E (IEC 47D/331/CDV:1999)
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series Subracks and associated plug-in units. Additional dimensions
€193.00
P-FBGA (Plastic Fine pitch Ball Grid Array), 0,5 mm (IEC 47D/315A/CD:1999)
€288.60
Applications ferroviaires - Montage des équipements électroniques
€59.33
Tape ball grid array package, 0,6 mm ball diameter family (IEC 47D/314A/CD:1999)
€128.22
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Sectional specification - Coordination dimensions for cases and cabinets
€44.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-1: Detail specification - Dimensions for cabinets
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2: Detail specification - Dimensions for cases
Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
€41.78
Proposal for 60 and 90 Pin P-FBGA (Plastic Fine pitch Ball Grid Array) 0,8 mm (IEC 47D/316A/CD:1999)
