Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series. Subracks and associated plug-in units Injector/extractor handle
€193.00
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series. Subracks and associated plug-in units Electrostatic discharge protection
€165.00
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series. Subracks and associated plug-in units Keying
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series. Subracks and associated plug-in units Alignments and/or earth pin
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-101: Subracks and associated plug-in units (IEC 48D/255/CD:2000)
€105.42
Mechanical structures for electronic equipment. Tests IEC 60917 and 60297 Seismic tests cabinets racks
Mechanical structures for electronic equipment. Dimensions of mechanical the 482.6 mm (19 in) series. Subracks and associated plug-in units Rear mounted
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German version prEN 60191-6:2000
€116.64
Mechanical standardization for semiconductor devices - Small Outline J-Lead package (SOJ) 0,80 mm pitch (IEC 47D/411/CDV); German version prEN 60191-2-46:2001
€41.78
Mechanical standardization for semiconductor devices - Plastic enhanced, low profile quad flatpack (HLQFP) - Outline family, heat slug up, L-PQFP-G (IEC 47D/410/CDV:2001); German version prEN 60191-2-49:2001
€84.58
Mechanical standardization for semiconductor devices - Plastic low profile quad flatpack (HLQFP) - Outline family, heat slug down (IEC 47D/407/CDV:2000); German version prEN 60191-2-50:2000
Mechanical standardization of semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug up T-PQFP-G (IEC 47D/418/CDV:2001); German version prEN 60191-2-51:2001
Mechanical standardization for semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug down (IEC 47D/408/CDV:2001); German version prEN 60191-2-52:2001
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification - Climatic, mechanical tests and safety aspects for cabinets and cases
€44.00
Mechanical structures for electronic equipment - Outdoor enclosures. Part 2-2: Detail specification - Dimension for cases.
€54.00
