31.240 : Mechanical structures for electronic equipment

NF EN IEC 61587-6, C93-471-6 (05/2021)

NF EN IEC 61587-6, C93-471-6 (05/2021)

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Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6 : security aspects for indoor cabinets - Structures mécaniques pour équipements électriques et électroniques - Essais pour les séries IEC 60917 et IEC 60297 - Partie 6 : Aspects liés à la sécurité des baies intérieures.

€95.67

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DIN 41494 Beiblatt 1:1992-12

DIN 41494 Beiblatt 1:1992-12

Withdrawn Most Recent

Mechanical structures for electronic equipments; mechanical structures of the 482,6 mm series; guide for the application

€63.27

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DIN 41618-4:1976-02

DIN 41618-4:1976-02

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Multipole connectors with blade contacts 2,5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622

€24.39

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DIN 41881-2:1978-06

DIN 41881-2:1978-06

Withdrawn Most Recent

Semiconductor devices; metal cases with ceramic insulation, requirements and tests

€24.39

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DIN 41494-3:1972-01

DIN 41494-3:1972-01

Withdrawn Most Recent

ASA-Panel mounting racks; stacking of sets

€24.39

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DIN 41593:1989-09

DIN 41593:1989-09

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Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

€63.27

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DIN EN 62966-2:2018-12

DIN EN 62966-2:2018-12

Superseded Historical

Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 2: Details of air flow, air separation and air cooling requirements (IEC 48D/679/CD:2018); Text in German and English

€116.64

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DIN EN 62610-6:2018-12

DIN EN 62610-6:2018-12

Superseded Historical

Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 Series - Part 6: Air recirculation and bypass of indoor cabinets (IEC 48D/678/CD:2018); Text in German and English

€111.40

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DIN EN 60191-4:2019-02

DIN EN 60191-4:2019-02

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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018.

€128.22

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DIN EN IEC 62610-2:2019-04

DIN EN IEC 62610-2:2019-04

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Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling (IEC 62610-2:2018); German version EN IEC 62610-2:2018

€105.42

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DIN EN IEC 60286-3:2019-08

DIN EN IEC 60286-3:2019-08

Superseded Historical

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019); German version EN IEC 60286-3:2019.

€145.14

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DIN EN IEC 62966-1:2019-12

DIN EN IEC 62966-1:2019-12

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Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 62966-1:2019); German version EN IEC 62966-1:2019

€98.32

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DIN EN IEC 61837-2:2019-02

DIN EN IEC 61837-2:2019-02

Superseded Historical

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018); German version EN IEC 61837-2:2018.

€261.78

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DIN EN 60917-1:2018-08

DIN EN 60917-1:2018-08

Superseded Historical

Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard (IEC 48D/666/CD:2018); Text in German and English

€111.40

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DIN EN IEC 60191-1:2018-10

DIN EN IEC 60191-1:2018-10

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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018.

€140.00

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