Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002.
€105.42
Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-VQFN (IEC 47D/483/CDV:2002); German version prEN 60191-6-7:2002
€69.91
Guidance on terms for connectors and mechanical structures in electronic equipment
€355.00
Amendment 1 - Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
€11.00
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001); German version EN 60191-4:1999 + A1:2002.
€91.03
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2001); German version EN 60679-3:2001.
€111.40
Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
€128.22
Mechanical structures for electronic equipment - Outdoor enclosures -- Part 3: Sectional specification - Climatic, mechanical tests and safety aspects for cabinets and cases.
€51.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification; Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 61969-3:2001); German version EN 61969-3:2001.
€77.20
Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
€34.30
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
€36.00
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment A2 (IEC 47D/452/CDV:2001); German version EN 60191-4:1999/prA2:2001
€41.78
Modular order for the development of mechanical structures electronic equipment practices Generic standard
€269.00
