Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA (IEC 47D/621/CDV:2005); German version prEN 60191-6-16:2005
€84.58
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005)
€122.34
Terminology Relating to Measurements Taken on Thin, Reflecting Films
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Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004.
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits (IEC 47/1797/CD:2004)
€69.91
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2004); German version EN 61837-4:2004.
€77.20
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/310/CD:2004)
€63.27
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions for subracks and plug-in units (IEC 48D/304/CD:2004)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 49/610/CDV:2003); German version prEN 61837-4:2003
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 -- Part 2: Seismic tests for cabinets and racks
€61.00
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; Interface co-ordination dimensions for the 25 mm equipment practice; Section 3: Extended detail specification; Dimensions for subracks chassis, backplanes, front panels, and plug-in units (IEC 48D/285/CD:2003)
€105.42
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
€34.30
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002.
€98.32
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
€171.00
