Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (IEC 48D/397/CD:2009)
€69.91
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1. (IEC 48D/391/CDV:2009); German version FprEN 60297-3-106:2009
€91.03
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 48D/392/CDV:2009); German version FprEN 60917-2-4:2009
€84.58
Rotating electrical machines Efficiency classes of single-speed, three-phase, cage-induction motors (IE-code)
€193.00
Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes
€88.00
Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width
€44.00
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/838/CD:2009)
€98.32
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/839/CD:2009)
€116.64
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 49/840/CD:2009)
€111.40
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/845/CD:2009)
€248.22
Packaging of components for automatic handling with unidirectional leads on continuous tapes
€316.00
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
Arc welding equipment Electromagnetic compatibility (EMC) requirements
€269.00
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007.
