Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011.
€214.30
Mechanical structures for electronic equipment. Outdoor enclosures Design guidelines
€193.00
Mechanical structures for electronic equipment. Outdoor enclosures Environmental requirements, tests and safety aspects
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
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Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices (Withdrawn 2023)
Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines
€44.00
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
€88.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions
€176.00
Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films (Withdrawn 2026)
Terminology Relating to Measurements Taken on Thin, Reflecting Films
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
€98.32
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure
€127.00
Mechanical structures for electronic equipment-Thermal management - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 48D/453/CD:2010)
€84.58